Apple will reportedly use a more advanced SoIC packaging technology for its M5 chips, as part of a two-pronged strategy to meet its growing demand for silicon that powers consumer Macs. can power and improve the performance of its data centers and the future AI tools that rely on it. the cloud.
Developed by TSMC and unveiled in 2018, SoIC (System on Integrated Chip) technology allows chips to be stacked in three-dimensional structures, providing better electrical efficiency and thermal management than traditional two-dimensional chip designs. she does.
According to Economic DailyApple has expanded its collaboration with TSMC on a next-generation hybrid SoIC package that also incorporates thermoplastic carbon fiber composite molding technology. The package is said to be in a small trial production phase, with the goal of mass-producing the chips in 2025 and 2026 for new Macs and AI cloud servers.
References to Apple's M5 chip have already been discovered in official Apple code. Apple is working on processors for its AI servers made with TSMC's 3nm process, targeting mass production by the second half of 2025. shut up
Currently, Apple's AI cloud servers are believed to be running on multiple connected M2 Ultra chips, which were originally designed only for desktop Macs. Whenever the M5 is adopted, its innovative dual-use design is believed to pave the way for Apple's future to vertically integrate its supply chain for AI functionality in its computers, cloud servers, and software. is the symbol of the project.
(Via DigiTimes.com.)
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