Samsung Showcases AI-Era Vision and Latest Foundry Technologies at SFF 2024 – Samsung Global Newsroom

State-of-the-art 2nm and 4nm process nodes revealed, as well as turnkey Samsung AI solutions to meet growing AI demand

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The SAFE Forum and the inaugural MDI Alliance Workshop will run the day after SFF to foster stronger collaboration and discuss innovative packaging design.

Samsung Electronics, a global leader in advanced semiconductor technology, today unveiled its latest foundry innovations and outlined its vision for the AI ​​era during the Samsung Foundry Forum (SFF) US, the company's Device Solutions America. Headquarters held in San Jose, California. .

Under the theme “Empowering the AI ​​Revolution,” Samsung announced its robust process technology roadmap, including two new advanced nodes – SF2Z and SF4U – as well as its integrated Samsung AI solution platform, its Foundry, Leverages the unique strengths of Memory and Advanced. Package (AVP) business.

“At a time when multiple technologies are evolving around AI, the key to its implementation lies in high-performance, low-power semiconductors,” said Dr. Seung Choi, President and Head of Foundry Business at Samsung Electronics. . Along with our proven GAA process optimized for AI chips, we plan to introduce integrated, co-packaged optics (CPO) technology for high-speed, low-power data processing, providing our customers with one-stop AI. Provide the solutions they need to grow. In this age of change.”

The event featured presentations from prominent industry leaders such as Arm CEO Rene Haas and Grooq CEO Jonathan Ross, who emphasized a strong partnership with Samsung to address new AI challenges. Nearly 30 partner companies exhibited at booths, further highlighting the dynamic collaboration in the US foundry ecosystem.

Empowering customer AI solutions with the latest process technology roadmap

Samsung announced two new process nodes, the SF2Z and SF4U, reinforcing its flagship process technology roadmap.

The company's latest 2nm process, SF2Z, incorporates Optimized Backside Power Delivery Network (BSPDN) technology, which places power rails on the back side of the wafer to eliminate bottlenecks between power and signal lines. Applying BSPDN technology to SF2Z not only increases power, efficiency and area (PPA) compared to SF2, the first-generation 2nm node, but also significantly reduces voltage drop (IR drop), increasing the efficiency of HPC designs. Is. Mass production of the SF2Z is ​​expected by 2027.

SF4U, on the other hand, is a high-end 4nm variant that offers improved PPA by adding optical shrinkage, with mass production scheduled for 2025.

Samsung confirmed that its preparations for SF1.4 (1.4nm) are progressing smoothly, with performance and production targets on track for mass production in 2027. Material and structural innovations.

Continue to drive the maturity of the GAA

With the onset of the AI ​​era, structural developments such as Get All Around (GAA) have become inevitable to meet the power and efficiency requirements. At SFF, Samsung emphasized the maturity of its GAA technology, a key technological enabler in empowering AI.

Entering its third year of mass production, Samsung's GAA process continues to demonstrate continued maturity in both production and performance. Leveraging this accumulated GAA production experience, Samsung plans to mass-produce its second-generation 3nm process (SF3) in the second half of this year and to provide GAA on its upcoming 2nm process. .

Samsung's GAA production continues to grow from 2022 and is set to expand significantly in the coming years.

Highlighting cross-company collaboration for turnkey Samsung AI solutions

Another highlight was the unveiling of Samsung AI Solutions, a turnkey AI platform resulting from collaborative efforts across the company's foundry, memory and AVP businesses.

Combining the unique strengths of each business, Samsung is offering high-performance, low-power and high-bandwidth solutions that can be tailored to specific customer AI needs.

Cross-company collaboration also streamlines supply chain management (SCM) and reduces time-to-market, leading to a significant improvement in total turnaround time (TAT) by 20%.

Samsung plans to introduce an all-in-one, CPO-integrated AI solution in 2027, aiming to provide consumers with one-stop AI solutions.

Diversifying users and applications for a balanced portfolio from mainstream tech to AI

Samsung is also making significant strides in diversifying its customer base and application areas.

Over the past year, Samsung Foundry's AI sales have grown by 80 percent with close customer support, demonstrating its dedication to meeting changing market demands.

In addition to its core process nodes, Samsung offers PPA specialty and 8-inch wafer derivatives with continuous improvement and strong cost competitiveness. With this balanced technology portfolio, the company is catering to the needs of customers in automotive, medical, wearable and IoT applications.

Transforming AI and technology to drive the foundry ecosystem towards collective growth

Building on the momentum of the SFF event, Samsung will also host its annual Samsung Advanced Foundry Ecosystem (SAFE™) Forum on June 13. Themed “AI: Exploring Possibilities and Future”, the forum will serve as a collaborative platform for ecosystem partners. To discuss custom technologies and solutions tailored for AI.

At this year's forum, Siemens CEO Mike Allo, AMD Vice President Bill N. and Celestial AI CEO David Lazowski are among industry leaders discussing the future of chip and system design technologies. Will offer insightful perspectives.

The forum will also feature the inaugural workshop of the Multi-Die Integration (MDI) Alliance, following the launch of the MDI Alliance last year. Samsung will engage in extensive discussions with its alliance partners on mutual development opportunities and specific collaborative initiatives, focusing on 2.5D and 3D IC designs for the development of integrated solutions. These activities will further strengthen partnerships and promote a collective vision.

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