The Samsung logo is displayed on a glass door at the company’s Seocho building in Seoul on July 7, 2022. Samsung Electronics has begun applying for tax breaks for 11 potential chip plants in Texas, which would generate about $192 billion in investment, according to documents filed in Texas. Authorities
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Samsung Electronics said on Tuesday that it has developed a new high-bandwidth memory chip that has the “highest capacity ever” in the industry.
The South Korean chip company claims that the HBM3E 12H “increases both performance and capacity by more than 50 percent.”
Yongcheol Bae, executive vice president of memory product planning at Samsung Electronics, said, “Industry AI service providers require HBM with greater capacity, and our new HBM3E 12H product is designed to answer that need. Designed for.”
“This new memory solution is part of our drive to develop core technologies for high-stack HBM and provide technical leadership for the high-capacity HBM market in the AI era,” said Bae.
Samsung Electronics is the world’s largest manufacturer of dynamic random access memory chips, which are used in consumer devices such as smartphones and computers.
Generative AI models such as OpenAI’s ChatGPT require large numbers of high-performance memory chips. Such chips enable creative AI models to remember details of past interactions and user preferences to generate human-like responses.
AI Boom Fuels Chip Makers American chip designer Nvidia Revenue grew 265% in the fourth fiscal quarter thanks to increased demand for its graphics processing units, thousands of which are used to run and train ChatGPT.
During a call with analysts, Nvidia CEO Jensen Huang said the company may not sustain this level of growth or sales throughout the year.
“As AI applications continue to grow rapidly, the HBM3E 12H is expected to be an excellent solution for future systems that require more memory. Its high performance and capacity are especially important for users to maximize their resources. will allow flexible management and lower total cost of ownership for data centers.” Samsung Electronics said.
Samsung said it has begun sampling the chip to customers and mass production of the HBM3E 12H is planned for the first half of 2024.
“I assume this news will be positive for Samsung’s share price,” Daiwa Securities Executive Director SK Kim told CNBC.
“Samsung was behind SK Hynix in HBM3 for Nvidia last year. Also, Micron announced mass production of the 24GB 8L HBM3E yesterday. I assume it’s a high-layer (12L) based high-end for Nvidia. density (36GB) HBM3E will gain product leadership,” said. less
According to a report by the Korea Economic Daily, which cited anonymous industry sources, in September Samsung signed a contract to supply its high-bandwidth Memory 3 chips to Nvidia.
The report also states that SK Hynix, South Korea’s second-largest memory chip maker, is leading the high-performance memory chip market. SK Hynix was previously known as the only major producer of HBM3 chips supplied to Nvidia, the report said.
Samsung said that the HBM3E 12H has a 12-layer stack, but it applies an advanced thermal compression non-conductive film that allows 12-layer products to meet the current HBM package requirements of an 8-layer height specification. Gives. The result is a chip that packs more processing power without increasing its physical impact.
“Samsung has continued to reduce the thickness of its NCF material and achieved the industry’s smallest gap between chips at seven micrometers (µm), while also eliminating gaps between layers,” Samsung said. said “These efforts have resulted in a 20 percent increase in vertical density compared to its HBM3 8H product.”